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Metallographic Preparation of SMD Resistor Samples

As a core passive component in the modern electronics industry, SMD Resistors (Surface Mount Device Resistors) are the “invisible workhorses” with the highest usage in electronic equipment. Featuring a lead-free design, they are directly mounted on circuit boards via surface mount technology (SMT). Constructed with an alumina ceramic substrate, paired with metal-glass glaze or vacuum-sputtered alloy resistor films, they are manufactured through precision processes.

Key advantages of this component: Compact size for high-density packaging, resistance to high temperatures and humidity, low temperature coefficient, and precision as high as ±0.01%. Widely used in consumer electronics, 5G base stations, automotive electronics, and other fields, they quietly perform critical functions such as current limiting and voltage division.

The structural morphology and dimensional specifications of the electroplated nickel and tin layers at both ends directly determine the long-term operational stability of the component. To clearly reveal the cross-sectional microstructure of these two layers, here’s a reference for the metallographic preparation process of SMD Resistors:

1️⃣ Grind to the edge of the target position using a P400 resin-bonded diamond grinding disc;

2️⃣ Fine grinding to the target position with a POS grinding disc + 9μm PD-WT polycrystalline diamond;

3️⃣ Rough polishing with SC-JP polishing cloth + 3μm PD-WT polishing slurry;

4️⃣ Final polishing with ZN-ZP polishing cloth + SO-T439 50nm polishing solution.

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