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Home / News / Knowledge / Case Sharing: Semipol for Grinding & Polishing of Silicon-Based Chip End Faces

Home / News / Knowledge / Case Sharing: Semipol for Grinding & Polishing of Silicon-Based Chip End Faces

Case Sharing: Semipol for Grinding & Polishing of Silicon-Based Chip End Faces

Objective: Grind and polish the chip end face to a mirror finish, ensuring end face perpendicularity and no edge chipping.
Key Challenges: Silicon-based chips are brittle, small in size, and difficult to fix during sample preparation.
Material: Silicon-based chip

Equipment & Accessories

Equipment: Semipol high-precision grinding and polishing machine
Accessories: Thin-sheet sample mounting fixture

Consumables
Diamond lapping films (15μm, 9μm, 3μm, 0.5μm)
ZN-ZP polishing cloth
AO-W aluminum oxide polishing suspension

Features of Semipol Equipment
Semipol is a high-precision grinding and polishing device capable of accurate semi-automatic sample preparation for various materials. It offers a maximum grinding capacity of 10mm, a resolution of 1μm, and a stability accuracy of ±2μm.

Suitable for high-precision grinding and polishing of integrated circuits, semiconductor wafers, optical components & optical fibers, petrographic samples, precision metal parts, and other materials.

Equipped with multiple fixtures to handle grinding and polishing of samples of different shapes and sizes.

Preparation Scheme

Grinding with diamond lapping films (particle sizes: 15μm → 9μm → 3μm → 0.5μm, gradual refinement).

Polishing with ZN-ZP polishing cloth + AO-W aluminum oxide polishing suspension.

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