Polishing and microscopic characterization of gold alloy sheet coatings for microelectronic packaging- Trojan (Suzhou) material technology Co., Ltd.

Polishing and microscopic characterization of gold alloy sheet coatings for microelectronic packaging

27-05-2025

Gold alloy sheets generally refer to thin sheet materials made of gold alloy used for connecting, fixing or packaging electronic components, etc. Due to the extremely high electrical conductivity, good thermal conductivity, high chemical stability, good flexibility and ductility of gold, the surface of the gold alloy sheets is widely used in microelectronic packaging and the manufacturing of optoelectronic devices after being gold-plated.

To measure the thickness of the coating on the gold alloy sheets, they are now polished for sample preparation: Since the sample size is very small and light in weight, to prevent the sample from floating in the liquid epoxy resin, an X-type sample holder is used for fixation.

Transparent slow-curing epoxy resin TJ2226 is combined with the ThetaMount pressure cold embedding machine for cold embedding, and then sample preparation is carried out on the Alpha 208 dual-control dual-disc polishing machine. The specific steps are as follows:
1. Planar grinding with silicon carbide sandpaper P800/P1200/P2000
2. Coarse polishing with YS polishing cloth + 3-micron diamond polishing suspension
3. Finishing polishing with ET polishing cloth + 1-micron aluminum oxide polishing suspension

Observation is carried out using the MN80 metallographic microscope, and when magnified to 500 times, the gray coating on the sample surface can be clearly seen, with a thickness of 2-3 μm. The gold coating needs to be magnified to a higher magnification on the SEM scanning electron microscope to be visible.