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Home / News / Knowledge / Sample Preparation for PCB Palladium-Gold Plating Coatings

Home / News / Knowledge / Sample Preparation for PCB Palladium-Gold Plating Coatings

Sample Preparation for PCB Palladium-Gold Plating Coatings

ENEPIG (Electroless Nickel-Palladium-Gold) stands as a dominant surface finish for high-performance PCBs. Built with compact, uniform Ni-Pd-Au triple-layer coating, it features superb oxidation & corrosion resistance plus low contact resistance.

It eliminates black pad issues from conventional immersion gold while supporting both soldering and wire bonding for complex electronic assembly.

PCB layer structure
Figure 1: Cross-sectional metallographic view of the PCB layer structure

Key Applications

  • Semiconductor packaging substrates: ideal for Cu/Au wire bonding
  • Automotive ECU & vehicle radar: anti-shock & resistant to wide temperature/oil pollution
  • Medical precision equipment & aerospace PCBs: stable under extreme working conditions
  • 5G base stations, high-frequency components & HDI circuit boards: massive volume adoption
Plating quality inspection
Figure 2: Microscopic inspection of the continuous plating quality

Thanks to outstanding durability and process compatibility, ENEPIG is the vital finishing for reliable precision interconnection on premium electronics.

Multi-layer alignment
Figure 3: Multi-layer alignment and interface analysis

Metallographic Specimen Prep Parameters for ENEPIG PCB

  1. Grinding: MET-SP P400~P4000
  2. Fine Polishing: SC cloth + 1μm PD-WT
  3. Final Polishing: ZN cloth + 50nm SO-439
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ENEPIG coating interface
Figure 4: High-magnification detailed view of the ENEPIG coating interface

#Trojan #Trojanmetallography #ENEPIG #PCBManufacturing #SurfaceFinishing #Metallography #ElectronicsManufacturing #HDI #SemiconductorPackaging #AutomotiveElectronics #5GPCB #MaterialPreparation

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