EP 1001 Epoxy Adhesive (10:1)
EP 1001 is a rigid, fast-curing, two-component epoxy adhesive.
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EP 1001 is a rigid, fast-curing, two-component epoxy adhesive.
Product Features:
1. A (resin) / B (hardener) mixed at a volume ratio of 10:1 cures bubble-free in 5 minutes at 150°C.
2. Once cured, it resists most chemical etchants.
3. Turns red upon curing.
Applications:
EP 1001 is commonly used for small or precision samples (e.g., IC devices), adhering multiple samples for TEM stacking, pre-coating samples before encapsulation, and filling PCB microvias. It exhibits excellent adhesion to various materials, including metals, ceramics, glass, and most plastics.
Ordering Information:
Order No. | Description | Package |
02.04.903 | Epoxy Resin, Liquid | 10g |
02.04.904 | Epoxy Hardener, Liquid | 1g |
02.04.905 | Epoxy Resin, Liquid | 100g |
02.04.906 | Epoxy Hardener, Liquid | 10g |